The Centro Superior de Diseño de Moda de Madrid, Universidad Politécnica de Madrid (CSDMM-UPM) is organising the III TECHS & CRAFTS International Congress on Fashion Design. 2026. Fashion Engineering, which will take place in Madrid from the18th to the 20th of March 2026.
This edition marks forty years of dialogue between technique and design culture at the CSDMM and aims to bring together researchers, professionals, and institutions to reflect on fashion from historical, technical, and design perspectives. The conference will address fashion as a technical, productive, and cultural system, highlighting fashion engineering as a meeting point between innovation and design, as well as the importance of understanding and integrating what we once did into what we do today in order to move towards a better future.
On the mornings of the18th and 19th of March 2026, guest experts will deliver lectures at the Museo del Traje CIPE. During those same days, in the afternoon, presentations by the researchers selected through this Call for Papers will take place at ETSAM-UPM. All presentations will be held in person.
Themes & Topics (non-exhaustive):
Fashion engineering: processes, systems, tools
Organization and management of production and distribution
Materials, technologies, and technical innovation in fashion
Education and knowledge transfer in fashion engineering
History of technology, technique & aesthetics, design culture
Sustainability, circularity, and responsible production models
Those interested in participating may submit their proposals (in Spanish/English) as follows:
Deadline: January, 18, 2026
Send to: congreso.csdmm@upm.es
File format: PDF
Email subject: CFP – TECHS & CRAFTS 2026 – [Author(s) Surname(s)]
Participants are asked to submit a proposal of up to 400 words, including the title, author, institutional affiliation, and abstract. The scientific advisory committee will review the proposals and determine their acceptance or rejection.
Accepted contributions will be allotted 15 minutes for oral presentation during the conference.