Special Issue “Advances in Tangible and Embodied Interaction for Virtual and Augmented Reality

Notification Due

Jun 26, 2026

Final Version Due

Jun 26, 2026

Submission Deadline

Apr 30, 2022

Dear Colleagues,

Virtual and augmented reality technology has seen tremendous progress in recent years, enabling novel and exciting ways to interact inside virtual environments. An interesting approach to interaction in VR and AR is the use of tangible user interfaces, which leverage on our natural understanding of the physical world and how our bodies move and interact with it, and on our learned capabilities to manipulate physical objects.

For this Special Issue, we are interested in gathering research that bridges atoms and bits in virtual and augmented environments. Basic research papers that demonstrate new interaction technologies or techniques, descriptions of applications that use tangibles in VR/AR in any domain, and survey papers that can help structure and systematize current knowledge on this area are all suitable. Topics of interest include, but are not limited to:

Technologies for object detection/recognition in AR

Interaction techniques that use tangibles/embodied interactions

Haptic systems and interactions for VR/AR

Authoring systems

Programming libraries, toolkits, and frameworks

Applications in cultural heritage, medicine, rehabilitation, gaming, entertainment, teaching, training, visualization, etc.

Design methodologies

Evaluation methodologies

Dr. Jorge C. S. Cardoso

Dr. André Perrotta

Dr. Paula Alexandra Silva

Dr. Pedro Martins

Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI’s English editing service prior to publication or during author revisions.

Keywords

virtual reality

VR/AR applications

brain science for VR/AR

VR/AR collaboration

computer graphics for VR/AR

tangible interaction

embodied interaction

multimodal VR/AR

haptics

human–computer interactions in VR/AR

human augmentations with VR/AR

human–computer interactions in VR/AR

human factors in VR/AR

programming libraries/toolkits for VR/AR

360 video

3D experiences

digital storytelling

mobile technologies

human–robot interactions with VR/AR