The First International IEEE Workshop on Thermal Modeling and Management: Chips to Data Centers
Call for Papers
http://www.bu.edu/peaclab/temm11/
High power densities and operating temperatures in multiprocessor systems impose a number of undesirable effects: performance degradation, reliability deterioration, high-energy costs, and physical damage leading to system failures. Recent research has shown that adverse effects of temperature can be modulated by efficient thermal monitoring, dynamic thermal management, thermally-aware architectures, temperature-aware compilation, hybrid computing fabrics, or by novel cooling technologies. Hardware and software design and runtime management methods, spanning from chips to datacenters, play an integral role in the overall thermal behavior and cooling costs. ITRS projects “Temperature Aware Design” as one of the cross-cutting design challenges for future manycore systems.
The main goal of this workshop is to provide a forum for the researchers to share the most recent developments and ideas on thermal modeling and management in various layers of system design and management: hardware design, algorithms, applications and software, operating systems, middleware, and datacenter-level solutions. The topics of interest include, but are not limited to:
* Thermal Modeling of Manycore / 3D Systems
* Thermal Analysis of Computing and Communication Layers
* Temperature Sensor Placement Algorithms
* Thermally-Aware Design Flows
* Thermal Management at Various Abstractions
* Interconnect / TSV Role in Thermal Optimizations
* Thermal Modeling of Large Scale Distributed Embedded Systems
* Thermally-Aware Distributed Computing
* Context-aware Thermal Management
* Thermal Footprint of Datacenters
* Physically Aware 3D Thermal Management
* Electro-Mechanically Aware Thermal Models
* Network Infrastructures for Enhanced Thermal Management
* Thermally-Aware Embedded Computing Applications
* Co-optimization of Cooling Energy and Computation/ Communication Energy
* Variation Aware Thermal Management in Manycore / 3D Systems
* Thermal Modeling and Management in Emerging Technologies
* Cooling Mechanisms and Technologies in 2-1/2 D, 3D, Hybrid Cores
Submission Guidelines: Prospective authors are invited to submit papers not exceeding 6 pages (4~6 pages) in length in standard IEEE two-column format for regular sessions. The IEEE template can be downloaded at: http://www.ieee.org/conferences_events/conferences/publishing/templates.html. Prospective authors should submit an electronic copy of their completed manuscript through the EasyChair portal at:https://www.easychair.org/conferences/?conf=temm2011. Selected papers from the TEMM workshop will be invited to submit as full-length papers in the special edition for Journal of Sustainable Computing: http://ees.elsevier.com/suscom/.
The submission and acceptance timeline is given below.
Paper submission date: April 25 2011
Notification date: May 25 2011
Camera Ready papers: June 6 2011
Registration: All participants will be required to register for the IGCC’11 conference (http://www.green-conf.org). The registration includes access to the workshop. For any questions related to the workshop, please contactqqiu@binghamton.edu.
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Workshop Co-Chairs:
Dhireesha Kudithipudi, Rochester Institute of Technology, USA
Qinru Qiu, Binghamton University, USA
Ayse Kivilcim Coskun, Boston University, USA
Publicity Chair:
Sherief Reda, Brown University, USA
Technical Program Committee:
David Atienza, EPFL, Switzerland
Jose Ayala, Compultense Univ. of Madrid, Spain
Tianzhou Chen, Zhejiang University, China
Siddharth Garg, University of Waterloo, Canada
Kartik Gopalan, Binghamton University, USA
Omer Khan, MIT, USA
Eren Kursun, IBM T.J. Watson Research Center, USA
Byeong Lee, Univ. of Texas San Antonio, USA
Gang Quan, Florida International University, USAÊ
Emre Salman, Stony Brook University, USA
Mircea Stan, University of Virginia, USA