11th Workshop on Testing: Academia-Industry Collaboration, Practice and Research Techniques

Event Dates

Apr 11, 2016 - Apr 11, 2016

Location

Chicago, IL, USA

Submission Deadline

Feb 05, 2016

+++ UPDATE: Deadline Extension +++

The submission deadline has been extended to February 5, 2016.

+++ Theme and Goals +++

TAIC PART is a workshop co-located with ICST 2016 that aims to forge collaboration between industry and academia on the challenging and exciting problem of real-world software testing. It is promoted by representatives of both industry and academia, bringing together industrial software engineers and testers with researchers working on theory and practice of software testing.

The goals of TAIC PART range from the articulation of research questions in the field of software testing and analysis to practical challenges faced in industry. The common theme is the discussion and advancement of approaches and methods for sustainable collaboration between academia and industry in software testing.

Tricentis BEST PAPER AWARD: The best paper presented at TAIC PART 2016 wins an iPad Air 2! Kindly sponsored by Tricentis – The Continuous Testing Company (http://www.tricentis.com). The best paper will be selected from the submitted regular papers based on the reviews by the program committee.

+++ Topics of Interest +++

TAIC PART invites submissions relevant to practice and research including

+ Industry experience reports: practical and generalizable insights into how to apply and extend existing approaches to software testing and analysis

+ Research methods for collaborative research: ways that industry and academia can collaborate to further knowledge on testing, verification and validation

+ Industrial challenges with real-world testing: describe a real-world software testing problem for which industry seeks help from academia or vice versa

+ Knowledge exchange between industry and academia: how can new results and knowledge be exchanged between the two partners

+++ Submission and Proceedings +++

+ Regular Papers (6 pages): Experience reports, research papers, longer challengebpapers (extension up to 10 pages may be possible on request)

+ Fast Abstracts (2 pages): Challenges in practice and research, work in progress, positions statements

Authors should submit a PDF version of their paper through the TAIC PART 2016 paper submission site: http://easychair.org/conferences/?conf=taicpart2016. All accepted papers will be part of the ICST joint workshop proceedings published in the IEEE Digital Library.

+++ Organization and Contact +++

+ Rudolf Ramler, Software Competence Center Hagenberg, Austria (General Chair)

+ Michael Felderer, University of Innsbruck, Austria (Program Co-Chair)

+ Takashi Kitamura, National Institute of Advanced Industrial Science and Technology (AIST), Japan (Program Co-Chair)

+ Darko Marinov, University of Illinois at Urbana-Champaign, USA (Local Chair)

If you have any questions or require more information on TAIC PART 2016, please visit the web site http://www2016.taicpart.org/ or write to rudolf.ramler(at)scch.at.

+++ Program Committee +++

Pekka Aho, VTT, Finland

Cyrille Artho, National Institute of Advanced Industrial Science and Technology, Japan

Jeff Ayars, Groupon, USA

Sigrid Eldh, Ericsson AB, Sweden

Emelie Engström, Lund University, Sweden

Vladimir Entin, OMICRON electronics, Austria

Elizabeta Fourneret, University of Franche-Comté, France

Vahid Garousi, Yusifoglu Atilim University, Turkey

Mark Harman, University College London, United Kingdom

Sam King, Twitter Inc., USA

Bogdan Korel, Illinois Institute of Technology, USA

Johann Krautlager, Airbus Helicopters, Germany

Shan Lu, University of Chicago, USA

Mika Mäntylä, University of Oulu, Finland

Stefan Mohacsi, Atos, Austria

Reinhold Plösch, Johannes Kepler University Linz, Austria

Mukul Prasad, Fujitsu, USA

Ina Schieferdecker, Fraunhofer FOKUS, Germany

Per Runeson, Lund University, Sweden

Haruto Tanno, NTT, Japan

Guilherme Horta Travassos, Federal University of Rio de Janeiro, Brazil

Tatsuhiro Tsuchiya, Osaka University, Japan

Peter Zimmerer, Siemens Corporate Technology, Germany