9th International Conference on Machine Learning and Soft Computing

Event Dates

Jan 24, 2025 - Jan 26, 2025

Location

Tokyo, Japan

Submission Deadline

Aug 30, 2024

A 1-page PDF flyer is available at:

https://icmlsc.org/files/CFP-ICMLSC%202025.pdf

The 9th International Conference on Machine Learning and Soft Computing (ICMLSC 2025) will be held on January 24-26, 2025 in Tokyo, Japan. The conference is organized by Chuo University, Japan, co-organized by Keiai University, Japan, and supported by University of Muenster, Germany and Concordia University, Canada.

For the past 8 years, ICMLSC went to Singapore in 2024, went virtual in 2021-2023 (due to the impact of COVID-19), and went to Haiphong City, Da Lat, Phu Quoc Island and Ho Chi Minh City in 2017-2020. This conference is highlighted by more and more audiences who joined us. We look forward to your participation and continued engagement at future ICMLSC series.

The ICMLSC Conference offers an opportunity to discuss new issues, tackle complex problems and find advanced solutions to enable shaping new trends in Machine Learning and Soft Computing

Submitted papers will be subject to stringent peer review by at least three experts and carefully evaluated based on originality, significance, technical soundness, and clarity of exposition.

Conference Tracks

Track 1: Data Science and Computing

Track 2: Artificial Intelligence and Digital Transformation

Track 3: Intelligent Computing and Application

Track 4: Image Processing and Recognition

The ICMLSC 2025 conference topics are the following (but are not limited to):

Intelligent search

Automated reasoning and logic programming

Machine learning

Intelligent planning

Neural computing

Visual/linguistic perception

Evolutionary and swarm algorithms

Derivative-free optimization algorithms

Emotional intelligence

Hybridization of intelligent models/algorithms

Parallel and distributed realization of intelligent algorithms/systems

Applications

Submissions should be at least 3 pages and no more than 10 pages using the 2-column IEEE conference paper template.