International Symposium of EDA (ISEDA 2026)
Dte: MAY 8-10, 2026
Venue: Singapore
Website: https://www.eda2.com/iseda/index.html
Advised by IEEE/CEDA and ACM/SIGDA, and organized by EDA², the ISEDA (International Symposium of EDA) is an annual premier forum dedicated to VLSI design automation. The symposium aims at exploring the new challenges, presenting leading-edge technologies and providing EDA community with opportunities of predicting future directions in EDA research areas. ISEDA covers the full range of EDA topics from device and circuit levels up to system level, from analog to digital designs as well as manufacturing. The format of meeting intends to cultivate productive and novel interchangeable ideas among EDA researcher and developers. Academic and industrial EDA related professionals who are interested in EDA’s theoretical and practical research are all welcomed to contribute to ISEDA.
▶ Committee
Executive Committee
▢ General Chairs
Prof. Hao, Yue, Professor of Xidian University, Academician of the Chinese Academy of Sciences
Prof. Wang, Runsheng, Peking University
▢ Steering Committee
Prof. Wei, Shaojun, Tsinghua University
Prof. Zeng, Xuan, Fudan University
Dr. Girard, Patrick, French National Center for Scientific Research
Prof. Deen, Jamal, McMaster University
Dr. Tanurhan, Yankin, Synopsys
Technical Program Committee
▢ Conference Chairs
Dr. Hui, Chiu Wing Colin, GlobalFoundries
Prof. Ho, Tsung-Yi, The Chinese University of Hong Kong
Prof. Qu, Gang, University of Maryland
▢ Technical Program Chairs
Prof. Yu, Bei, The Chinese University of Hong Kong
Prof. Schlichtmann, Ulf, Technical University of Munich
Ms. Leung, Kafai, A*STAR Institute of Microelectronics
▢ Keynote Chair
Prof. Liang, Yun, Peking University
▢ Publication Chair
Prof. Xu, Qiang, The Chinese University of Hong Kong
▢ Panel Chair
Mr. Ong, Jonathan, Applied Materials
▢ Industry Chair
Mr. Lam, Lup Meng, Synopsys
▢ Special Session Chair
Mr. Ghosh, Swaroop, Pennsylvania State University
▢ Publicity Chair
Prof. Basu, Kanad, Rensselaer Polytechnic Institute
▢ Tutorial Chair
Prof. Sasan, Avesta, University of California, Davis
▢ Tutorial Co-chair
Prof. Lim, Yeow Kheng, National University of Singapore
▢ Outreach Chair – US
Prof. Forte, Domenic, University of Florida
▢ Outreach Chair – Europe
Prof. Halak, Basel, University of Southampton
▢ Outreach Chair – Asia
Prof. Li, Yongfu, Shanghai Jiao Tong University
▢ Outreach Chair – Canada
Prof. Chun, Peter, University of Alberta
Track Committee
▢ System-Level Modeling and Design Methodology
Chairs:
Sun, Qi, Zhejiang University
Zhao, Jieru, Shanghai Jiao Tong University
▢ Memory Architecture and Near/In Memory Computing
Chairs:
Chen, Xiaoming, Institute of Computing Technology, CAS
Zhang, Li, Technical University of Darmstadt
▢ Analog-Mixed Signal Design Automation
Chairs:
Zhu, Keren, Fudan University
Du, Li, Nanjing University
▢ High-Level, Bahavioral, and Logic Synthesis and Optimization
Chairs:
Qian, Weikang, Shanghai Jiao Tong University
Pilato, Christian, Politecnico di Milano
▢ Analysis and Optimization for Power and Timing
Chairs:
Xie, Zhiyao, The Hong Kong University of Science and Technology
Li, Bing, Technische Universität Ilmenau
▢ Physical Implementation
Chairs:
Ma, Yuzhe, The Hong Kong University of Science and Technology (Guangzhou)
Lin, Yibo, Peking University
▢ Testing, Validation, Simulation, and Verification
Chairs:
Zhang, Hongce, The Hong Kong University of Science and Technology (Guangzhou)
Zheng, Yuanjin, Nanyang Technological University
▢ Design for Manufacturability and Reliability
Chairs:
Chen, Yu-Guang, National Central University
Li, Meng, Peking University
▢ Packaging & Multi-Physics Simulation
Chairs:
Peng, Yarui, Southeast University
Tseng, Tsun-Ming, Technical University of Munich
▢ Technology and Modeling
Chairs:
Ng, Kian Ann, DigiPen Institute of Technology Singapore
Chen, Quan, Southern University of Science and Technology
▢ Emerging Technologies and Applications
Chairs:
Lee, Vincent, National University of Singapore
Li, Xingquan, Peng Cheng Laboratory
▢ AI & Open Source EDA
Chairs:
Yu, Cunxi, University of Maryland
Tan, Chee Wei, Nanyang Technological University
▶ Keynote Speakers
Prof. Luca Benini, Università di Bologna
Prof. Yeo, Yee Chia, Deputy Chief Executive (Innovation & Enterprise), A*STAR
Mr. Subramani Kengeri, Corporate Vice President and GM, Systems to Materials, Applied Materials
Prof. Yeo, Seng Kiat, Singapore University of Technology and Design
Mr. Don Chan, Vice president, Research & Development, Cadence Design Systems, Inc.
Prof. Keshab Parhi, University of Minnesota
Prof. Chakrabarty, Krishnendu, Fulton Professor of Microelectronics, Arizona State University
Prof. Massimo Alioto, National University of Singapore
Prof. Takahashi, Atsushi, Institute of Science Tokyo
Prof. Wunderlich, Hans-Joachim, Professor Emeritus of the University Stuttgart
▶ Call for Papers
Original papers in, but not limited to the following areas are invited:
[1] System-Level Modeling and Design Methodology
1.1 HW/SW co-design, co-simulation and co-verification
1.2 System-level design exploration, synthesis, and optimization
1.3 System-level formal verification
1.4 System-level modeling, simulation and validation
1.5 Networks-on-chip and NoC-based system design
1.6 Constructing Hardware in Scala Embedded Language
[2] Memory Architecture and Near/In Memory Computing
2.1 Storage system and memory architecture
2.2 On-chip memory architectures and management: Scratchpads, compiler, controlled memories, etc.
2.3 Memory/storage hierarchies and management for emerging memory technologies
2.4 Near-memory and in-memory computing
[3] Analog-Mixed Signal Design Automation
3.1 Analog/mixed-signal/RF synthesis
3.2 Analog layout, verification, and simulation techniques
3.3 High-frequency electromagnetic simulation of circuit
3.4 Mixed-signal design consideration
[4] High-Level, Behavioral, and Logic Synthesis and Optimization
4.1 Digital Simulation / Emulation
4.2 High-Level Synthesis
4.3 Logic Synthesis
4.4 Synthesis for Approximate Computing
[5] Analysis and Optimization for Power and Timing
5.1 Deterministic/statistical timing analysis and optimization
5.2 Process technology modeling for timing analysis
5.3 Power modeling, analysis and simulation
5.4 Low-power design and optimization at circuit and system levels
5.5 Thermal aware design and dynamic thermal management
5.6 Energy harvesting and battery management
[6] Physical Implementation
6.1 Floorplanning, partitioning, placement and routing optimization
6.2 Interconnect planning and synthesis
6.3 Clock network synthesis
6.4 Physical design of 3D/2.5D IC and package ( e. g. , TSV, interposer, monolithic)
6.5 Post layout and post-silicon optimization
6.6 Layout Verification
[7] Testing, Validation, Simulation, and Verification
7.1 RTL and gate-leveling modeling, simulation, and verification
7.2 Circuit-level formal verification
7.3 ATPG, BIST and DFT
7.4 System test and 3D IC test, online test and fault tolerance
7.5 Memory test and repair
[8] Design for Manufacturability and Reliability
8.1 Design-technology co-optimization (DTCO)
8.2 Standard and custom cell design and optimization
8.3 Reticle enhancement, lithography-related design optimizations and design rule checking
8.4 Design for manufacturability, yield, defect tolerance, cost issues, and DFM impact
8.5 Device-, gate, and circuit-level techniques for reliability analysis and optimization (e.g., soft error, aging, etc.)
8.6 Post-Layout optimizations
[9] Packaging & Multi-Physics Simulation
9.1 Extraction, TSV, and package modeling
9.2 Chiplet Design and Design tools
9.3 Chip Level Thermal Simulation
9.4 Packaging Stress Analysis
9.5 Multi-Physics Simulation
9.6 Signal/Power integrity, EM modeling and analysis
[10] Technology & Modeling
10.1 Device Compact Modeling
10.2 Process Design Kit
10.3 Semiconductor Process & Device Simulation
10.4 Cell Library Design, Characterization and Verification
10.5 New transistor/device and process technology: spintronic, phase-change, single-electron, 2D materials, etc.
[11] Emerging Technologies and Applications
11.1 Biomedical, biochip, nanotechnology, MEMS
11.2 Design automation for 3D ICs and heterogeneous integration
11.3 Design automation for quantum computing
11.4 Design automation for silicon photonics
11.5 Design automation for compound semiconductors verification
[12] AI & Open Source EDA
12.1 Artificial Intelligence for EDA
12.2 Cloud / Parallel Computing for EDA
12.3 Open Source EDA
12.4 EDA Database
12.5 EDA Standardization
▶ Submission Requirements
Please read the following submission guidelines carefully before preparing and submitting your manuscript.
Authors are invited to submit original papers, which have not been published elsewhere and are not currently under consideration for another journal, conference or workshop. Research findings can be submitted as full papers. All paper submissions must be done electronically using the submission system.
Best Paper Award, Honorable Mention Paper Award will be selected after the presentations.
Invited Talks: Need an abstract within one page
Extended Abstract: 1-2 pages
Regular Full Paper: 4-6 pages
*Note: Extended abstract will not be published. If you have the publication purpose, please submit full paper before the deadline.
▶ Submission System
https://www.eda2.com/conferenceHome/submissionHome
▶ Contact Us
Paper Submission: Joyce Zhong, iseda@eda2.com
EDA²: Qiuping Huang, conference_affairs@eda2.com
Local Contact: Summer Boo, info@siliconexus.co or +65-89220304