2026 International Conference on Artificial Intelligence and Computing Power (ICAICP 2026) to be held in Hangzhou, China, May 29-31, 2026.
𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/6fMzYv
—𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀—
The topics of interest for submission include, but are not limited to:
◕ Artificial Intelligence
Machine Learning
Deep Learning Models and Architectures
Natural Language Processing
Computer Vision
Pattern Recognition
Reinforcement Learning
Evolutionary and Bio-inspired Computation
Knowledge Representation and Reasoning
Data Mining and Knowledge Discovery
Intelligent Agents and Multi-Agent Systems
Human-Computer Interaction
AI Safety and Trustworthy AI
Explainable AI
Adaptive and Autonomous Systems
Intelligent Decision-Making Systems
◕ Computing Power
High-Performance Computing (HPC)
Distributed and Parallel Computing
Cloud Computing
Edge and Fog Computing
Heterogeneous and Accelerated Computing
Resource Scheduling and Management
Large-Scale Data Center Systems
Data Center Networking
High-Speed Interconnects
Storage Systems and Distributed File Systems
Hybrid Cloud Storage Optimization
Energy-Efficient and Carbon-Aware Computing
Computing Power Optimization for AI Workloads
AI-Driven System Optimization
Virtualization and Container-Based Computing
Integrated AI and Computing Power Systems
— 𝗞𝗲𝘆𝗻𝗼𝘁𝗲 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀—
Prof. Carlos A. Coello Coello,CINVESTAV-IPN
Prof. Xiaoyong Liu,Guangdong Polytechnic Normal University
Prof. Feiwei Qin,Hangzhou Dianzi University
Prof. Gexiang Zhang,Chengdu University of Information Technology
—𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻—
All papers submitted to ICAICP 2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in ACM ICPS (ACM International Conference Proceeding Series) and will be submitted to EI Compendex / Scopus for indexing.
—𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀—
Full Paper Submission Date: May 15, 2026
Registration Deadline: May 25, 2026
Final Paper Submission Date: May 25, 2026
Conference Dates: May 29-31, 2026
— 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻—
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/6fMzYv