2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 2026.
๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ ๐ช๐ฒ๐ฏ๐๐ถ๐๐ฒ: https://ais.cn/u/RrIzUf
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The topics of interest for submission include, but are not limited to:
โElectronic materials
Physical chemistry
Semiconductor material
Conductive metals and their alloys
Electromagnetic shielding material
Dielectric material
Piezoelectric and ferroelectric materials
Magnetic material
Optoelectronic material
Integrated circuit
โInformation engineering:
Electronic science and technology
Information and communication Engineering
Optoelectronic information science and technology
Engineering optics
Information optics
Electronic technology
Photoelectric technology
Communication technology
Measurement and control technology
Computer application technology
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Prof. Jiankun Hu,IEEE Fellow,The University of New South Wales (UNSW), Australia
Prof. Lei Zhang,Nanjing University of Information Science and Technology, China
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All papers, both invited and contributed, will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers of EMIE 2026 will be published in SPIE – The International Society for Optical Engineering (ISSN: 0277-786X), and indexed by EI Compendex and Scopus.
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Submission Deadline: June 22, 2026
Registration Deadline: July 3, 2026
Final Paper Submission Date: July 10, 2026
Conference Dates: July 17-19, 2026
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Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/RrIzUf