2026 International Conference on Condensed Matter Physics and Artificial Intelligence

Event Dates

Apr 17, 2026 - Apr 19, 2026

Location

San Francisco, USA/ Hybrid

Submission Deadline

Apr 10, 2026

2026 International Conference on Condensed Matter Physics and Artificial Intelligence(CMPAI 2026) will be held on April 17-19, 2026 in San Francisco, USA/ Hybrid.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://www.aischolar.com/conference/cmpai2026?invite=wiki

—𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀—

The topics of interest for submission include, but are not limited to:

◕ AI in Superconductivity and Magnetism

Design and optimization of superconducting materials

Prediction of magnetic properties and new phases

AI-assisted study of superconducting and magnetic mechanisms

Machine learning applications in magnetic quantum materials

Intelligent experimental data processing and analysis

Smart control for superconducting devices

◕ AI in Low-dimensional and Topological Physics

Identification and classification of topological materials

Electronic state analysis in low-dimensional systems

Topological quantum computing and information processing

Dynamics simulations of low-dimensional heterostructures

Detection of topological phases and experimental data analysis

◕ AI in Non-equilibrium and Statistical Physics

Simulations of non-equilibrium dynamics and phase transitions

Modeling of many-body system dynamics

Analysis of thermal transport and energy conversion

Theoretical modeling of non-equilibrium systems

Deep learning in complex dissipative systems

Integration of intelligent simulations with experimental data

◕ Intelligent Methods in Computational and Materials Physics

AI-assisted electronic structure calculations

Multiscale materials simulations with machine learning

High-throughput materials screening and design

Analysis of defects and interfaces in electronic structures

Machine-learned potentials and accelerated simulations

AI research in energy materials

Other …

—𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀 (𝗜𝗻𝘁𝗲𝗻𝗱 𝘁𝗼 𝗶𝗻𝘃𝗶𝘁𝗲)—

Prof. Daowen Qiu,Sun Yat-sen University, China

Assoc. Prof. Siow Kim Shyong,The National University of Malaysia, Malaysia

—𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻—

All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers of CMPAI 2026 will be published in the conference proceedings and will be submitted to EI Compendex and Scopus for indexing.

—𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀—

Registration Deadline: April 10, 2026

Final Paper Submission Date: April 10, 2026

Conference Dates: April 17-19, 2026

— 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻—

Please send the abstract or full paper(word+pdf) to Submission System:

https://www.aischolar.com/conference/cmpai2026/submission?invite=wiki