International Conference on Bionic Engineering (organised by Elsevier)

Event Dates

Sep 18, 2011 - Sep 20, 2011

Location

Boston, USA

Submission Deadline

Mar 25, 2011

Topic List

The conference brings together experts from around the world and addresses the following major topics:

Industry success stories

Impact on engineering

Sustainability and Responsibility

Understanding of materials in biomimetics

Environmental Aspects of biomimetics

Sensors and signal processing

Bio-inspired materials and self-x-mechanisms

Energy Systems

Fluid dynamics

Functional surfaces

Robotics, motion systems and artificial intelligence

Textiles (medical / technical / fashion)

Medicine (prosthetics and orthotics)

Agriculture

Materials

Architecture & Built Environment

The Elsevier International Bionic Engineering Conference 2011 aims to bridge the gap between academic research and industrial development in a field that is rapidly growing and gaining recognition across many disciplines. Intended as a common ground for the exchange of ideas, the Organizers call upon key researchers in industry and academia from around the globe to engage each other with presentation and in conversation that inspires bionic solutions to some of the biggest engineering problems facing industry today. The meeting extends to North America from three successful international meetings organized by the Key Laboratory for Terrain-Machine Bionic Engineering at Jilin University in Changchun, China. The conference is also associated with the Journal of Bionic Engineering published by Elsevier and is the official title of the International Society of Bionic Engineering.

This is the 1st Conference in a new and exciting series of conferences associated with Journal of Bionic Engineering.

These conferences provide a new level of direct interaction between the leaders in the scientific field and the attending delegates. Emphasis will be placed on latest unpublished results, extended discussion periods and direct interactions with leaders in the field.