2011 International Conference on Solid-State and Integrated Circuit (ICSIC 2011) will be held in Shanghai, China during March 11 – 13, 2011. ICSIC 2011 will bring together top researchers from Asian Pacific areas, North America, Europe and around the world to exchange research results and address open issues in all aspects of Solid-State and Integrated Circuit.
All accepted papers will be published in the conference proceeding by IEEE, and will be included in the IEEE Xplore, and indexed by the INSPEC, Thomson ISI (ISTP), and Ei Compendex.
Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:
(1) Silicon integrated circuits and manufacturing
(2) Digital, Analog, Mixed Signal IC and SOC design technology
(3) Low-power, RF devices & circuits
(4) IC Computer-Aided –Design technology, DFM
(5) Silicon/germanium devices and device physics
(6) Interconnect, Low K, High K and other process technologies
(7) Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)
(8) Unconventional and nano-electronics
(9) Organic semiconductor devices and technologies
(10) Compound semiconductor devices and circuits
(11) Displays, sensors and MEMS
(12) Semiconductor materials and material characterization
(13) Reliability
(14) Modeling and simulation
(15) Packaging and testing technology
(16) Equipment technology
(17) Solar cell & other devices for new energy sources
(18) Others
Important Date:
Paper Submission (Full Paper) Before November 25, 2010
Notification of Acceptance On December 15, 2010
Final Paper Submission Before December 31, 2010
Authors’ Registration Before December 31, 2010
ICSIC 2011 Conference Dates March 11 – 13, 2011