Special Issue “Low k Dielectic Materials”
A special issue of Materials (ISSN 1996-1944)
Deadline for manuscript submissions: 30 September 2011
Website: http://www.mdpi.com/journal/materials/special_issues/die_materials/
Special Issue Information
Dear Colleagues,
For Low k dielectric materials, the value of dielectric constant is less than the dielectric constant of silicon dioxide. Such materials are of great importance for multi-level interconnections of nanoelectronics and radio frequency (RF) devices and circuits. Other applications include optoelectronics, 3-D integrated circuits, microelectromechanical systems (MEMS), nanoelectromechanical (NEMS), sensors and detectors and packaging of various types of devices and circuits. All topics related to synthesis, and properties of low-k dielectrics, various processing techniques, process integration, performance and reliability of low-K based devices, circuits and systems are of interest for this journal issue.
Dr. Rajendra Singh
Guest Editor
Keywords (included but not limited to)
* Low k dielectrics
* thermal properties
* structural properties
* process integration
* Low k and MEMS
* Low k and NEMS
* R-F devices and circuits
* Low k and 3-D integrated circuits
* multi-level Interconnections
* packaging
* reliability
* yield
Special Issue Editor
Guest Editor
Dr. Rajendra Singh
Holcombe Department of Electrical and Computer Engineering, & Center for Silicon Nanoelectronics, Clemson University, 105 Riggs Hall, Clemson, SC 29634, USA
Website: http://www.clemson.edu/ces/departments/ece/faculty_staff/faculty/rsingh.html
E-Mail: srajend[a]clemson.edu